4 Layer Half Hole Printed Circuit Board , Finished Thickness 0.8MM , HDI , Blind And Buried Holes
4 Layer Half Hole Printed Circuit Board With Blind And Buried Holes
PCB Specifications:
Layer Count: 4Layer Half Plated Hole PCB
Board Thickness: 0.8MM
Copper Thickness: 1/H/H/1OZ
BGA Size: 10 Mil, Via In Pad
Min Hole: 0.1MM
Min Line: 3/3 Mil
Hole: L1-L4
Blind Hole: L1-L2 0.1MM, L3-L4 0.1MM
Buried Hole: L3-L4 0.2MM
Solder Mask: Green
Surface Treatment: ENIG
Material: FR4
Unit Size: 84*92MM/4*4up
Special Treatment: 4 Side Half Plated Holes
Application: WIFI Module
Capabilities:
| Item |
Capability |
| Layer Count |
1-24 Layers |
| Board Thickness |
0.1mm-6.0mm |
| Finished Board Max Size |
700mm* 800mm |
| Finished Board Thickness Tolerance |
+/-10% +/-0.1(<1.0mm) |
| Warp |
<0.7% |
| Major CCL Brand |
KB/NanYa/LTEQ/ShengYi/Rogers Etc |
| Material Type |
FR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET |
| Drill Hole Diameter |
0.1mm-6.5mm |
| Out Layer Copper Thickness |
1/20Z-8OZ ; |
| Inner Layer Copper Thickness |
1/3OZ-6OZ |
| Aspect Ratio |
10:1 |
| PTH Hole Tolerance |
+/-3mil |
| NPTH Hole Tolerance |
+/-1mil |
| Copper Thickness Of PTH Wall |
>10mil(25um) |
| Line Width And Space |
2/2mil |
| Min Solder Mask Bridge |
2.5mil |
| Solder Mask Alignment Tolerance |
+/-2mil |
| Dimension Tolerance |
+/-4mil |
| Max Gold Thickness |
200u'(0.2mil) |
| Thermal Shock |
288C, 10s, 3 Times |
| Impedance Contro |
+/-10% |
| LTest Capability |
PAD Size Min 0.1mm |
| Min BGA |
7mil |
| Surface Treatment |
OSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable |
FAQ:
Question: What is the most common quality issue for this kinf of pcb?
Answer: 1) Copper burr in half holes
2) Oxidation in half holes
Product Tags:
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4 Layer Half Hole PCB Finished Thickness 0.8MM / Hdi Pcb Blind And Buried Holes Images
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